Diamond Bond Silicon Carbide Abrasive
Classification:
Product Description
It is used for rough grinding, medium grinding, fine grinding and polishing of ceramic tile surface. It is the grinding and polishing material with the longest application history and the most mature application technology in the field of hard and brittle material polishing. The company has a variety of specifications of silicon carbide modules, and can adjust the formula according to customer requirements.
Common specifications and related parameters
| Name DESCRIPTION | Model TYPE | Granularity GRIT | Use USED FOR |
| Magnesium Oxide Bonded Silicon Carbide Grinding Block MAGNESIUM OXIDE BOND SILICON CARBIDE ABRASIVE | L140(T1) | 24#、36#、46#、60#、80#、100#、120#、150#、180#、220#、240#、280#、320#、400#、600#、800#、1000#、1200#、1500#、1800#、2500#、3000#、5000#、6000#、8000#、10000# | Fine grinding FINE AND FINISH GRINDING AND POLISHING |
| L170(T2) |
Other specifications are customized according to customer requirements
Keyword：
Ceramic polishing grinding block series
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